In the silver plating of copper, K[Ag(CN)2] is used instead of AgNO3. The reason is

Question

In the silver plating of copper, K[Ag(CN)₂] is used instead of AgNO₃. The reason is

a thin layer of Ag is formed on Cu

more voltage is required

Ag⁺ ions are completely removed from solution

less availability of Ag⁺ ions, as Cu can not displace Ag from [Ag(CN)₂]^$-$ ion.

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